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Yuexin Semiconductor's Fushan project to be completed in 2024


Updated: 2022-08-09

Machine installation and equipment debugging are now underway at the 3.5-billion-yuan ($517.4-million) Zhuhai Yuexin Semiconductor's high-end RF and FCBGA packaging production base in Doumen District's Fushan Industrial Park, which is expected to start operations at the end of 2024.

Zhuhai Yuexin Semiconductor is a wholly-owned subsidiary of Doumen-based Access Semiconductor, which is the earliest domestic enterprise producing IC package substrates. Its products of RF, processor, and system-level embedding package substrates now lead in the global market.


A worker operates a machine in the factory of Zhuhai Yuexin Semiconductor's high-end RF and FCBGA packaging production base [Photo by He Tanpo & Chen Qingyang / Zhuhai Daily]

Xie Fengxia, deputy general manager of Access Semiconductor, said that the project will generate annual output value of 3.5 billion yuan ($518 million) upon operation and will help the enterprise maintain its current industrial advantages, such as topping the global supply of RF package substrates.

Doumen District has been devoting efforts to form an industrial development pattern featuring Fushan Industrial Park, Xinqing Science & Technology Industrial Park, Doumen Eco-Agriculture Park, and Doumen Intelligent Manufacturing Park to further develop industrial clusters of new information technology, new energy and materials, high-end equipment manufacturing, as well as modern agriculture. 

The district's added value of industries above designated size in the first half of the year increased by 6 percent year-on-year to 10.79 billion yuan ($1.6 billion), while that of the hi-tech, advanced manufacturing, and equipment manufacturing industries grew by 13.1 percent, 19.8 percent, and 15.8 percent respectively.

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